Semiconductors
Sila Secures $1.4B Loan for U.S. Battery Manufacturing
Sila, an advanced battery technology company, has received a conditional loan commitment of up to $1.4 billion from the U.S.
Semiconductors
Kioxia GP Series Wins FMS Best of Show Award
Kioxia Corporation has received the "Best of Show" award in the Specialized Storage category at the FMS: the Future of
Semiconductors
Toshiba Accelerates IoT Security Strategy with Launch of TXZ+ M4V Microcontrollers
Toshiba Electronic Devices & Storage Corporation has officially announced the availability of engineering samples for its TXZ+™ Family Entry-Class M4V Group. This
Cloud
Extrcool Innovations for High-Density Data Center Liquid Cooling
As artificial intelligence clusters drive thermal loads to unprecedented levels, conventional air conditioning systems are increasingly struggling to maintain stability. Current data
AI
Amazon's Zoox Launches Paid Robotaxi Rides in Las Vegas
Amazon-owned Zoox is transitioning from free testing to commercial operations, announcing it will begin charging for paid robotaxi rides in Las Vegas
AI
AMD AI Revenue Forecast Meets Expectations but Misses Investor Optimism
Advanced Micro Devices (AMD) delivered a robust second-quarter performance, reporting revenue of $11.54 billion and surpassing Wall Street’s consensus estimates.
Semiconductors
Samsung and SK Hynix Test AMEC Tools to Hedge US Risks
Samsung Electronics and SK Hynix are evaluating etching equipment from China's Advanced Micro-Fabrication Equipment (AMEC) for potential use at their
Cloud
The Infrastructure Bottleneck: Bitzero Partners with Vertiv to Scale AI-Ready Data Centers
The global race to dominate the artificial intelligence landscape has undergone a fundamental shift in focus. While the initial phase of the
Semiconductors
Kioxia Unveils PCIe 6.0 GP1 Series for AI Infrastructure
Kioxia Corporation has announced the KIOXIA GP1 Series, a new line of PCIe 6.0 NVMe SSDs engineered specifically for GPU direct
Semiconductors
Sandisk and SK hynix Release First OCP HBF Specification
Sandisk Corporation and SK hynix Inc. have announced the release of the High Bandwidth Flash (HBF) technical specification through the Open Compute
Cloud
M3 and Samsung Heavy Industries to Engineer U.S. Floating Data Centers
Mousterian Corporation (M3) and Samsung Heavy Industries (SHI) have signed an engineering contract to develop the first moored floating data center (FDC)
Enterprise Software
CACI and Oracle to Modernize OPM HR Systems
CACI International Inc has been selected as a technology partner for the U.S. Office of Personnel Management (OPM) Federal Human Resources
Semiconductors
Kioxia Unveils CXL XL1 Memory Expansion for AI
Kioxia Corporation has announced the KIOXIA XL1 series, a Compute Express Link (CXL) compatible memory expansion module designed to address increasing memory
Semiconductors
Reimagine Robotics Emerges from Stealth to Revolutionize Industrial Automation
In a significant move for the industrial automation sector, Reimagine Robotics has officially emerged from stealth mode, unveiling a suite of AI-powered
