The escalating demand for AI infrastructure is placing unprecedented pressure on high-bandwidth memory (HBM) manufacturing yields, forcing a shift toward more sophisticated process control. Onto Innovation (NYSE: ONTO) has been recognized by SK hynix with the Best Partner Award for technology achievement, marking it as the sole recipient in this category during the manufacturer's 25th Anniversary Partners Day on September 28, 2026. This recognition centers on Onto’s development of a defect prevention system designed to address the specific measurement challenges inherent in advanced HBM production cycles.
SK hynix Recognizes Onto Innovation Technology Achievement
SK hynix bestowed this honor upon Onto Innovation to acknowledge the company's contributions to HBM process control and advanced memory production. Specifically, the award highlights Onto's development of a defect prevention system utilizing breakthrough measurement technology tailored for HBM applications. According to Mike Plisinski, CEO of Onto Innovation, the recognition stems from a close collaboration between SK hynix and Onto’s product and customer success teams. The goal of this partnership is to identify hidden, yield-impacting defects that are critical to maintaining reliable HBM manufacturing. Onto is positioning its Dragonfly® system as a flexible solution capable of addressing the rapidly evolving application challenges presented by successive generations of HBM. By integrating these measurement capabilities, Onto aims to provide the process control insight necessary to identify critical defects earlier in the production flow, thereby helping SK hynix mitigate the risk of yield loss in high-value devices.
Addressing Complexity in 12- and 16-High HBM Stacks
As the industry moves toward 12- and 16-high HBM stacks, the physical architecture of memory is becoming increasingly difficult to inspect. These advanced configurations require thinner dies and more complex assembly flows, which significantly raises the probability of sub-surface defects and hidden cracks during the thinning, bonding, and assembly stages. With more connections packed into smaller bump sizes, the intensity of inspection must grow alongside the complexity of the stack. The economic stakes are rising because more value is concentrated in every individual device; consequently, the cost of discovering a defect late in the production cycle increases substantially. Onto’s Dragonfly G5 inspection system is designed to address these specific vulnerabilities by providing earlier detection of defects. This capability is particularly relevant as memory suppliers work to expand HBM capacity to meet AI-driven demand, which TrendForce expects to increase by more than 50% by 2027.
Key Takeaways
- Onto Innovation was the only company to receive the Best Partner Award for technology achievement from SK hynix at its 25th Anniversary Partners Day.
- The award recognizes Onto's defect prevention system and breakthrough measurement technology used in HBM applications.
- TrendForce projects that AI-driven HBM demand is expected to grow by more than 50% by 2027.
TechInsyte's Take
In our view, this award underscores a critical pivot in the semiconductor supply chain: as AI workloads drive HBM complexity, the bottleneck is shifting from raw capacity to yield management. The transition to 16-high stacks introduces structural risks that traditional inspection methods may struggle to catch. By securing this recognition, Onto Innovation is signaling that its Dragonfly G5 system is becoming a foundational component in the HBM roadmap. For enterprise leaders, this highlights that the scalability of AI infrastructure is now deeply tethered to the precision of sub-surface metrology and the ability of equipment providers to mitigate the high costs of late-stage manufacturing defects.
Questions & Answers
How does Onto Innovation's technology specifically impact HBM manufacturing yields?
Onto Innovation utilizes breakthrough measurement technology, specifically through its Dragonfly G5 inspection system, to identify hidden, yield-impacting defects earlier in the process. This is designed to reduce the risk of yield loss during the thinning, bonding, and assembly stages of high-value HBM devices.
Why is the complexity of HBM stacks increasing the risk of manufacturing defects?
The move toward 12- and 16-high HBM stacks requires thinner dies and more complex assembly flows. These physical changes increase the likelihood of sub-surface defects and hidden cracks, especially as more connections are packed into smaller bump sizes.
What is the projected market demand for HBM through 2027?
According to data from TrendForce cited in the announcement, HBM capacity must expand to meet AI-driven demand, which is expected to increase by more than 50% by 2027.
What role does the Dragonfly® system play in long-term HBM production?
Onto Innovation describes the Dragonfly® system as having inherent flexibility, which the company claims enables customers to consistently overcome the rapidly evolving application challenges presented by HBM generation after generation.
Source: Onto Innovation
